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MT46V16M8 PDF预览

MT46V16M8

更新时间: 2022-11-25 21:39:52
品牌 Logo 应用领域
镁光 - MICRON 动态存储器双倍数据速率
页数 文件大小 规格书
9页 167K
描述
DOUBLE DATA RATE DDR SDRAM

MT46V16M8 数据手册

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PREVIEW‡  
128Mb: x8  
DDR400 SDRAM Addendum  
MT46V16M8 – 4 Meg x 8 x 4 banks  
DOUBLE DATA RATE  
(DDR) SDRAM  
For the latest data sheet revisions, please refer to the Micron  
Website:www.micron.com/dramds  
FEATURES  
GENERAL DESCRIPTION  
• 200 MHz Clock, 400 Mb/s/p data rate  
• VDD = +2.65V 0.ꢀ0V  
The DDR400 SDRAM is a high-speed CMOS, dy-  
namic random-access memory that operates at a fre-  
quency of 200 MHz (tCK=5ns) with a peak data transfer  
rate of 400Mb/s. DDR400 continues to use the JEDEC  
standard SSTL_2 interface and the 2n-prefetch archi-  
tecture.  
• VDDQ = +2.65V 0.ꢀ0V  
• Bidirectional data strobe (DQS) transmitted/  
received with data, i.e., source-synchronous data  
capture  
• Internal, pipelined double-data-rate (DDR)  
architecture; two data accesses per clock cycle  
• Differential clock inputs (CK and CK#)  
• Commands entered on each positive CK edge  
• DQS edge-aligned with data for READs; center-  
aligned with data for WRITEs  
The standard DDR200/DDR266 data sheets also  
pertain to the DDR400 device and should be refer-  
enced for a complete description of DDR SDRAM func-  
tionality and operating modes. However, to meet the  
faster DDR400 operating frequencies, some of the AC  
timing parameters, DC levels and operating tempera-  
tures are slightly tighter. This addendum data sheet  
will concentrate on the key differences required to sup-  
port the enhanced speeds.  
• DLL to align DQ and DQS transitions with CK  
• Four internal banks for concurrent operation  
• Data mask (DM) for masking write data  
• Programmable burst lengths: 2, 4, or 8  
• Concurrent Auto Precharge option supported  
• Auto Refresh and Self Refresh Modes  
The Micron 128Mb data sheet provides full specifica-  
tions and functionality unless specified herein.  
t
t
• RAS lockout (tRAP = RCD)  
CONFIGURATION  
Architecture  
OPTIONS  
• Configuration  
PARTNUMBER  
16 Meg x 8  
4 Meg x 8 x 4 banks  
4K  
ꢀ6 Meg x 8 (4 Meg x 8 x 4 banks)  
ꢀ6M8  
TG  
Configuration  
Refresh Count  
• Plastic Package  
Row Addressing  
Bank Addressing  
Column Addressing  
4K (A0–A11)  
4 (BA0, BA1)  
1K (A0–A9)  
66-Pin TSOP  
(400mil with 0.65mm pin pitch)  
• Timing - Cycle Time  
5ns @ CL = 3(ꢀ)  
-5  
• Self Refresh  
Standard  
none  
KEYTIMINGPARAMETERS  
SPEED  
GRADE  
-5  
CLOCK RATE  
CL = 31  
DATA-OUT ACCESS DQS-DQ  
WINDOW2 WINDOW SKEW  
NOTE: 1. Supports modules with 3-4-4 timing  
200MHz  
2.15ns  
0.50ns +0.35ns  
NOTE: 1. CL = CAS (Read) Latency  
2. With a 50/50 clock duty cycle  
128Mb: x8DDR400 SDRAM  
128Mbx8DDR400.p65 – Rev. A (1/30/02-B)  
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.  
©2002,MicronTechnology,Inc.  
1
THIS DATA SHEET CONTAINS THE PRESENT DESCRIPTION OF A PRODUCT IN DEFINITION WITH NO FORMAL DESIGN IN PROGRESS.  

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