Datasheet > SiRA62DDP

SiRA62DDP

更新时间： 2024-04-09 19:01:53

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
7页	190K
描述
N-Channel 30 V (D-S) MOSFET

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SiRA62DDP 数据手册

SiRA62DDP

Vishay Siliconix

www.vishay.com

N-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PowerPAK^®SO-8 Single

• 100 % R_gand UIS tested

• Excellent R_DS- Q_gFigure-of-Merit (FOM)

for switch-mode power supplies

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

Top View

Bottom View

APPLICATIONS

PRODUCT SUMMARY

• High power density DC/DC

• Synchronous rectification

• Load switch

V_DS(V)

R_DS(on)max. () at V_GS= 10 V

0.00122

0.00195

20.8

R_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

• OR-ing

I_D(A)

191 ^a

Configuration

Single

N-Channel MOSFET

ORDERING INFORMATION

Package

PowerPAK^®SO-8

Lead (Pb)-free, halogen-free, BLR and IOL

SiRA62DDP-T1-UE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

+20, -16

191

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

153

Continuous drain current (T_J= 150 °C)

I_D

51 ^{b, c}

40 ^{b, c}

400

Pulsed drain current (t = 100 μs)

I_DM

I_S

_C= 25 °C

4.6 ^{b, c}

102

Continuous source-drain diode current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

5 ^{b, c}

3.2 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, f}

Maximum junction-to-case (drain)

SMYBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

1.4

1.75

°C/W

Notes

a. Based on T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

S24-0057-Rev. A, 22-Jan-2024

Document Number: 62491

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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