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SIR5208DP PDF预览

SIR5208DP

更新时间: 2024-04-09 19:02:08
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 197K
描述
N-Channel 20 V (D-S) MOSFET

SIR5208DP 数据手册

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SIR5208DP  
Vishay Siliconix  
www.vishay.com  
N-Channel 20 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen V power MOSFET  
PowerPAK® SO-8 Single  
D
D
7
8
D
6
• 2.5 V rated RDS(on)  
D
5
• 100 % Rg and UIS tested  
• Material categorization: for definitions of  
compliance please see  
www.vishay.com/doc?99912  
1
S
2
3
S
S
APPLICATIONS  
• Battery management  
• Load switching  
D
4
G
1
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
G
20  
RDS(on) max. () at VGS = 10 V  
0.0013  
0.0014  
0.00265  
24.6  
R
R
DS(on) max. () at VGS = 4.5 V  
DS(on) max. () at VGS = 2.5 V  
S
N-Channel MOSFET  
Qg typ. (nC)  
ID (A)  
165 g  
Configuration  
Single  
ORDERING INFORMATION  
Package  
PowerPAK SO-8  
Lead (Pb)-free and halogen-free  
SiR5208DP-T1-RE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-source voltage  
Gate-source voltage  
SYMBOL  
LIMIT  
20  
+8 / -7  
165  
UNIT  
VDS  
VGS  
V
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
132  
Continuous drain current (TJ = 150 °C)  
ID  
48 b, c  
38.4 b, c  
150  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
51.6  
4.3 b, c  
35  
61.25  
56.8  
Continuous source-drain diode current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
mJ  
W
TC = 70 °C  
36.3  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
4.8 b, c  
3.0 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) c  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
21  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
26  
2.2  
°C/W  
Maximum junction-to-case (drain)  
1.8  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 70 °C/W  
g. TC = 25 °C  
S24-0171-Rev. A, 26-Feb-2024  
Document Number: 62488  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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