Datasheet > S0402F_15

S0402F_15

更新时间： 2022-02-26 12:40:19

品牌	Logo	应用领域
固锝 - GOOD-ARK		/
页数	文件大小	规格书
3页	168K
描述
Chip Fuse

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S0402F_15 数据手册

Chip Fuse

Description

S0402F Series

■

Fast acting for excessive current

Compatible with reflow and wave solder

Rugged ceramic and glass construction

Excellent environmental performance

RoHS Compliant ,Lead Free & Halogen Free

material

OVERCOAT

Sn PLATING

Applications

■

Telecommunication: PDA / DSL/ Cell Phones

Computers: LCD Panel / Printers/ Laptop/

Servers

Cu / Ni PLATING

FUSE ELEMENT

CERAMIC SUBSTRATE

■

Consumer Electronics: DVD player / MP3

MP4 Player

Environmental Data

■

Life Test: 30°C ±2°C ,75% rated current, 1000 hours,

Humidity Bias: MIL-STD-202 , Method 103

Moisture Resistance Test: MIL-STD-202, Method 106G

Thermal Shock: MIL-STD-202, Method 107G

Terminal Strength: AEC-Q200-006

Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)

Vibration: MIL-STD-202, Method 204C

MechanicalShock:MIL-STD-202,Method 213C

Solderability: MIL-STD-202 Method 208H

Resistance to Solder Heat: MIL-STD-202,Method 210A

Electrical Characteristics

Ampere Rating

% of Amp Rating

Opening Time

200mA-4A

100%

4 Hours Minimum

200mA-4A

250%

5 Seconds Maximum

Electrical Specifications

Interrupting

Resistance

(ohms)**

Typ.

Typical

Voltage Rating

Product

Code

Current

Rating*

Melt I²t ***

DC (A²s)

0.0008

Rating

24V

S0402F200

S0402F250

S0402F375

S0402F500

200mA

250mA

375mA

500mA

35A

4.300

35A

3.200

0.0011

35A

1.140

0.0021

35A

1.200

0.0043

@copyright Good-Ark2012

www.goodark.com

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