SMBG4728 thru SMBG4764A, e3
SMBJ4728 thru SMBJ4764A, e3
SILICON 2.0 Watt ZENER DIODES
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
The SMBJ4728A-4764A and SMBG4728A-4764A series of surface mount
2.0 watt Zeners provides voltage regulation in a selection from 3.3 to 100
volts with different tolerances as identified by suffix letter on the part
number as well as RoHS Compliant with an e3 suffix. This surface mount
product series with lower thermal resistance features is equivalent to the
JEDEC registered 1N4728 thru 1N4764A with identical electrical
characteristics except it is rated at 2.0 W instead of 1.0 W. It is available
in J-bend design (SMBJ) with the DO-214AA package for greater PC
board mounting density or in Gull-wing design (SMBG) in the DO-215AA
for visible solder connections. Microsemi also offers numerous other
Zener products to meet higher and lower power applications.
NOTE: All SMB series are equivalent
to prior SMS package identifications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
•
•
•
Surface mount equivalent to 1N4728 to 1N4764A
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
•
Regulates voltage over a broad operating current
and temperature range
•
•
Wide selection from 3.3 to 100 V
Popular DO-214AA or DO-215AA packages and
footprints for either high density J-bend or Gull-wing
designs for visible solder joints
Standard voltage tolerances are plus/minus 5% with
A suffix and 10 % with no suffix identification
•
•
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
•
•
Nonsensitive to ESD per MIL-STD-750 Method
1020
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are available
by adding MQ, MX, or MV prefixes respectively to
part numbers.
Moisture classification: Level 1 per IPC/JEDEC J-
STD-020B with no dry pack required
•
RoHS compliant devices available by adding an e3
suffix.
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
Power dissipation at 25ºC: 2.0 watts (also see
derating in Figure 1).
•
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
•
•
Operating and Storage temperature: -65ºC to
•
TERMINALS: Gull-wing or C-bend (modified J-
bend) leads, tin-lead plated or RoHS compliant
annealed matte-tin plating solderable per MIL-STD-
750, method 2026
+150ºC
Thermal Resistance: 35 ºC/W junction to lead, or
100ºC/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint
(see last page)
Steady-State Power: 2 watts at TL < 80oC, or 1.25
watts at TA = 25ºC when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
•
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to opposite end for Zener regulation
•
•
•
MARKING: Includes part number without prefix
(e.g. 4728A, 4728Ae3, 4734C, 4764D, etc.)
•
•
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260 ºC for 10 s (maximum)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
•
•
WEIGHT: 0.1 grams
See package dimensions on last page
Copyright © 2007
6-20-2007 REV E
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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