8GB (x72, ECC, SR) 288-Pin DDR4 RDIMM
Features
DDR4 SDRAM RDIMM
MTA9ASF1G72PZ – 8GB
Figure 1: 288-Pin RDIMM (R/C-D1)
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
Module height: 31.25mm (1.23in)
• 288-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC4-3200, PC4-2933, or
PC4-2666
Options
Marking
• 8GB (1 Gig x 72)
• Operating temperature
– Commercial (0°C ≤ TOPER ≤ +95°C)
• Package
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 22 (DDR4-3200)
– 0.682ns @ CL = 21 (DDR4-2933)
– 0.75ns @ CL = 19 (DDR4-2666)
• VDD = 1.20V (NOM)
None
Z
• VPP = 2.5V (NOM)
• VDDSPD = 2.5V (NOM)
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
-3G2
-2G9
-2G6
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
20\
19
18\
17
16\
15
14\
13
12\
11
10\
9
tRCD
ns
tRP
ns
tRC
ns
PC4-
24
22
21
-3G2
-2G9
3200
3200,
2933
3200,
2933
2933
2666\
2666
2400\
2400
2133\
2133
1866\
1866
1600\
1600
1333\
–
13.75
13.75
45.75
2933
–
2933
2933
2666\
2666
2400\
2400
2133\
2133
1866\
1866
1600\
1600
1333\
–
14.32
14.32
46.32
(13.75)1 (13.75)1 (45.75)1
CCMTD-1725822587-9904
asf9c1gx72pz.pdf - Rev. J 05/2021 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
1
Products and specifications discussed herein are subject to change by Micron without notice.