NEW
High-Speed(10+Gbps) BGA Mezzanine Connectors
IT3 Series
ꢀFlexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10+Gbps systems.
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
ꢀMechanical features
ꢀ Unique 3-piece structure for flexibility
ꢀ Stacking heights from 15 to 40mm
(*15mmH is 2-piece)
∞
ꢀ Staggered 1.5mm 1.75mm ball grid array
Interposer
Signal Ground
ꢀ Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
ꢀ Differential, single-ended, and power
ꢀ Low mating/extracting forces
ꢀ Wide misalignment tolerances for multiple
connector use
Signal / Ground Configuration
ꢀ Both of SnPb and Pb-free are available
ꢀ Excellent reflow solderability
ꢀSignal integrity features
ꢀ
Insertion loss to Crosstalk Ratio (ICR)
60�
50�
40�
30�
20�
10�
�
0�
�
The ICR performance meets the extrapolated
IEEE 802.3ap specification for 6.25Gbps with
fully-populated pin assignment, and 10+Gbps
with skipped pin assignment.
ICR�
IEEE spec�
-10�
-20�
-30�
-40�
ꢀ Return Loss
The differential return loss meets the
extrapolated IEEE 802.3ap specification
up to 12GHz.
RL�
IEEE Spec�
0�
�
-50��
0�
0�
5�
10�
15�
20�
5�
10�
15�
20�
Frequency (GHz)�
Frequency (GHz)�
ꢀStacking height variations
Stacking Height
17mm
20mm
22mm
25mm
26mm
28mm
30mm
32mm
38mm
40mm
Contact Position
100
200
300
*
*
*
*
* : Under planning
2010.02
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