DFR0.5A-DFR0.5M
Surface Mount Fast Recovery Rectifiers
Features
Low profile space
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Ideal for automated placement
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SOD-123FL
Glass passivated chip junctions
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Low forward voltage drop
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Low leakage current
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0.075(1.90)
0.067(1.70)
0.043(1.09)
0.035(0.89)
High forward surge capability
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High temperature soldering:
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0.114(2.9)
0.098(2.5)
260℃/10 seconds at terminals
Component in accordance to
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RoHS 2002/95/1 and WEEE 2002/96/EC
0.008(0.20)
0.004(0.10)
0.047(1.19)
0.043(1.09)
Mechanical Date
Case: JEDEC SOD-123FL molded plastic
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0.030(0.76)
0.018(0.45)
body over glass passivated chip
Terminals: Solder plated, solderable per
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J-STD-002B and JESD22-B102D
Polarity: Laser band denotes cathode end
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0.154(3.9)
0.138(3.5)
Weight: 0.017gram
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Marking Information
Dimensions in inches and(millimeters)
LGE:Lu Guang Electronic
XXXX:marking code (0.5A-0.5M)
XXXX
Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(TA = 25 °C unless otherwise noted)
DFR-
Symbol 0.5A
0.5B
0.5D
0.5G
0.5J
0.5K
0.5M UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
50
35
50
100
70
200
140
200
400
280
400
0.5
600
420
600
800
560
800
1000
700
V
V
V
A
Maximum DC blocking voltage
100
1000
Maximum average forward rectified current
IF(AV)
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
15
IFSM
VF
A
V
Maximum instantaneous forward voltage at 0.5A
1.3
Maximum DC reverse current
at Rated DC blocking voltage
TA = 25 ℃
TA = 100℃
5.0
50
IR
μA
Maximum reverse recovery time at IF = 0.5 A , IR =
1.0 A , Irr = 0.25 A
150
500
trr
250
nS
Typical junction capacitance at 4.0 V ,1MHz
CJ
15
p F
Operating junction and storage temperature range TJ, TSTG
–55 to +150
℃
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mail:lge@lgesemi.com
Revision:20170701-P1