Datasheet > CMS17(TE12L,Q)

CMS17(TE12L,Q)

更新时间： 2024-01-04 05:40:48

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
5页	167K
描述
DIODE SCHOTTKY 30V 2A M-FLAT

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技术参数
数据手册

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CMS17(TE12L,Q) 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	unknown	风险等级：	5.73
Base Number Matches：	1

CMS17(TE12L,Q) 数据手册

CMS17

TOSHIBA Schottky Barrier Diode

CMS17

Switching Mode Power Supply Applications

Unit: mm

Portable Equipment Battery Applications

•

Forward voltage: V

Average forward current: I

Repetitive peak reverse voltage: V

= 0.48 V (max)

= 2.0 A

F (AV)

= 30 V

RRM

Suitable for compact assembly due to a small surface-mount package:

“M−FLAT ” (Toshiba package name)”

Absolute Maximum Ratings (Ta = 25°C)

Characteristic

Symbol

Rating

Unit

Repetitive peak reverse voltage

Average forward current

RRM

2.0 (Note 1)

30 (50 Hz)

−40~150

F (AV)

Nonrepetitive peak surge current

Junction temperature

FSM

°C

Storage temperature range

stg

Note 1: Ta = 77°C

Device mounted on a ceramic board

Board size: 50 mm × 50 mm

Soldering size: 2 mm × 2 mm

Board thickness: 0.64 t

JEDEC

JEITA

⎯

TOSHIBA

3-4E1A

Rectangular waveform (α = 180°), V = 15 V

Weight: 0.023 g (typ.)

Note 2: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating

conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristic

Symbol

Test Condition

= 1.0 A (pulse test)

Min

Typ.

Max

Unit

⎯

0.42

0.45

0.8

⎯

0.48

⎯

FM (1)

FM (2)

Peak forward voltage

= 2.0 A (pulse test)

= 5 V (pulse test)

= 30 V (pulse test)

RRM (1)

RRM (2)

RRM

Peak repetitive reverse current

Junction capacitance

μA

100

⎯

= 10 V, f = 1.0 MHz

Device mounted on a ceramic board

(board size: 50 mm × 50 mm)

(soldering land: 2 mm × 2 mm)

(board thickness: 0.64 t)

⎯

Device mounted on a glass-epoxy board

(board size: 50 mm × 50 mm)

(soldering land: 6 mm × 6 mm)

(board thickness: 1.6 t)

Thermal resistance

(junction to ambient)

th (j-a)

°C/W

135

Device mounted on a glass-epoxy board

(board size: 50 mm × 50 mm)

(soldering land: 2.1 mm × 1.4 mm)

(board thickness: 1.6 t)

⎯

210

Thermal resistance

(junction to lead)

th (j-ℓ)

⎯

°C/W

2006-11-13

12 3 4 5

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