BAV70DW
SURFACE MOUNT SWITCHING DIODE ARRAY
Please click here to visit our online spice models database.
Features
Mechanical Data
•
•
•
•
•
•
•
Fast Switching Speed
•
•
Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Orientation: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Two “BAV70” Circuits In One Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
•
•
•
•
•
•
•
SOT-363
A2
C1
A2
C2
A1
A1
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
Value
100
Unit
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
75
V
RMS Reverse Voltage
53
V
VR(RMS)
IFM
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
300
150
mA
mA
IO
2.0
1.0
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Symbol
PD
Value
200
Unit
mW
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
625
°C/W
Rθ
TJ , TSTG
JA
-65 to +150
°C
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
75
V
V(BR)R
⎯
IF = 2.5μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
0.715
0.855
1.0
Forward Voltage
V
VF
⎯
1.25
VR = 75V
μA
μA
μA
nA
2.5
50
30
25
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
Reverse Current (Note 2)
IR
⎯
Total Capacitance
2.0
4.0
pF
CT
trr
⎯
⎯
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
ns
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
1 of 3
www.diodes.com
April 2008
© Diodes Incorporated
BAV70DW
Document number: DS30132 Rev. 11 - 2