AFCT-5701xxZ, AFCT-5705xxZ, AFCT-5710xxZ,
AFCT-5715xxZ, AFCT-5765xxZ
Single-Mode SFP Optical Transceivers
with Optional DMI for Gigabit Ethernet and Fibre Channel
Reliability Data Sheet
Introduction
FIT Rate Summary
Avago Technologies Quality System includes an ongoing The mean and standard deviation of the AFCT-5701xxZ,
Reliability Monitoring program to generate a database AFCT-5705xxZ, AFCT-5710xxZ, and AFCT-5715xxZ families
from which this reliability datasheet is published.
of SFP Optical Transceiver steady-state failure rate is calcu-
lated as 118.4 FIT and 66.6 FIT at 40 °C, respectively.
Description
Conclusion
This reliability data sheet addresses reliability parameters
for the single-mode AFCT-5701xxZ, AFCT-5705xxZ, AFCT- Avago Technologies AFCT-5701xxZ, AFCT-5705xxZ, AFCT-
5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of 5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of
SFP optical transceivers.
SFP Optical Transceivers have completed and passed the
reliability qualification criteria defined by Avago Technol-
ogies’Quality & Reliability requirements.
These transceivers are primarily targeted at serving
Gigabit Ethernet or Fibre Channel links interconnecting
optical networking and storage equipment.
Random Failure Rate (FIT) Calculation
Reliability Qualification
Failure in time rate, or FIT, is defined as the number of
failures per billion device hours. In the product useful life
region, the random failure rate is considered as a constant
failure rate. In this region MTTF, Mean Time to Failure, is
defined as MTTF = 1/FIT.
The Optical Transceivers have been qualified in accor-
dance with the requirements of Telcordia Document
GR-468-CORE. Reliability predictions follow the method of
Telcordia SR-332 Issue 3.
FITs Prediction Based on Telcordia SR-332 Parts Count
Procedure
Avago internal test specifications have also been applied.
Testing was carried out under the supervision of Avago
Technologies Quality & Reliability Department.
The Telcordia Parts Count Method assumes that the
module failure rate is equal to the sum of the device
component failure rates. Modifiers are included to take
into consideration variations in module operation envi-
ronments, device quality requirements, temperature, and
stress. Table 1a shows the FITs for the components used in
the module and the total FITs that has been calculated for
a case temperature of 40 °C.
Stress Test Pass Criteria
Product failure has occurred when the units fails to
respond properly to a functional test condition. The func-
tional test condition should not exceed the absolute
maximum data sheet limits for the product.