Datasheet > AD670-703D

AD670-703D

更新时间： 2024-02-09 05:28:50

品牌	Logo	应用领域
亚德诺 - ADI		转换器
页数	文件大小	规格书
7页	775K
描述
2-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDIP20, CERAMIC, METAL SEALED, SIDE BRAZED, DIP-20

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AD670-703D 技术参数

生命周期：	Active	包装说明：	DIP,
Reach Compliance Code：	compliant	ECCN代码：	3A001.A.2.C
HTS代码：	8542.39.00.01	风险等级：	5.62
最长转换时间：	13 µs	转换器类型：	ADC, PROPRIETARY METHOD
JESD-30 代码：	R-CDIP-T20	模拟输入通道数量：	2
位数：	8	功能数量：	1
端子数量：	20	最高工作温度：	125 °C
最低工作温度：	-55 °C	输出位码：	OFFSET BINARY, 2'S COMPLEMENT BINARY
输出格式：	PARALLEL, 8 BITS	封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装代码：	DIP	封装形状：	RECTANGULAR
封装形式：	IN-LINE	标称供电电压：	5 V
表面贴装：	NO	温度等级：	MILITARY
端子形式：	THROUGH-HOLE	端子位置：	DUAL
Base Number Matches：	1

This specification documents the detail requirements for space qualified product manufactured on Analog

Devices, Inc.’s QML certified line per MIL-PRF-38535 Level V except as modified herein. The manufacturing

flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to be considered a

part of this specification. http://www.analog.com/aerospace. This data sheet specifically details the space

grade version of this product. A more detailed operational description and a complete data sheet for

commercial product grades can be found at www.analog.com/AD670.

Part Number

AD670-703D

Description

8-Bit low cost signal conditioning ADC

Letter

Descriptive designator

CDIP2-T20

Case Outline (Lead Finish per MIL-PRF-38535)

20-Lead ceramic, metal sealed, side-brazed leads

V_CCto ground......................................................................................................0V to +7.5V

Digital inputs (Pins 11-15) .......................................................................-0.5V to V_CC+0.5V

Digital outputs (Pins 1-9) ............................................. Momentary short to VCD or ground

Analog inputs (Pins 16-19) .......................................................................................... ±30V

Power dissipation......................................................................................................450mW

Storage temperature range ........................................................................-65°C to +150°C

Lead temperature range (soldering)......................................................................... +300°C

Operating temperature range ..................................................................... -55°C to +125°C

Junction Temperature (T_J)......................................................................................... 150°C

Thermal Resistance, Sidebrazed (D) Package

Junction-to-Case (4JC) = 25°C/W Max

Junction-to-Ambient (4JA) = 85°C/W Max

12 3 4 5 6 7

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