1Gb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H256M4 – 32 Meg x 4 x 8 banks
MT47H128M8 – 16 Meg x 8 x 8 banks
MT47H64M16 – 8 Meg x 16 x 8 banks
Options1
Marking
Features
Configuration
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VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
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256 Meg x 4 (32 Meg x 4 x 8 banks)
128 Meg x 8 (16 Meg x 8 x 8 banks)
64 Meg x 16 (8 Meg x 16 x 8 banks)
256M4
128M8
64M16
–
–
–
FBGA package (Pb-free) – x16
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84-ball FBGA (8mm x 12.5mm)
Rev. G, H
FBGA package (Pb-free) – x4, x8
HR
HQ
–
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
8 internal banks for concurrent operation
Programmable CAS latency (CL)
60-ball FBGA (8mm x 11.5mm)
Rev. G
–
Posted CAS additive latency (AL)
FBGA package (Pb-free) – x4, x8
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WRITE latency = READ latency - 1 tCK
Selectable burst lengths (BL): 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
60-ball FBGA (8mm x 10mm) Rev. H
FBGA package (lead solder) – x16
CF
–
84-ball FBGA (8mm x 12.5mm)
Rev. G, H
HW
–
FBGA package (lead solder) – x4, x8
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On-die termination (ODT)
60-ball FBGA (8mm x 11.5mm)
Rev. G
HV
JN
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Industrial temperature (IT) option
RoHS-compliant
FBGA package (lead solder) – x4, x8
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60-ball FBGA (8mm x 10mm) Rev. H
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Supports JEDEC clock jitter specification
Timing – cycle time
1.875ns @ CL = 7 (DDR2-1066)
2.5ns @ CL = 5 (DDR2-800)
2.5ns @ CL = 6 (DDR2-800)
3.0ns @ CL = 4 (DDR2-667)
3.0ns @ CL = 5 (DDR2-667)
3.75ns @ CL = 4 (DDR2-533)
-187E
-25E
-25
-3E
-3
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–
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-37E
Self refresh
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Standard
Low-power
Operating temperature
– Commercial (0°C ≤ TC ≤ 85°C)
– Industrial (–40°C ≤ TC ≤ 95°C;
–40°C ≤ TA ≤ 85°C)
None
L
–
–
None
IT
AT
:G/:H
– Automotive (–40°C ≤ TC , TA ≤ 105ºC)
Revision
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1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
Note:
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
© 2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.