Datasheet > MT47H128M8

MT47H128M8

更新时间： 2022-12-16 16:49:26

品牌	Logo	应用领域
镁光 - MICRON		动态存储器双倍数据速率
页数	文件大小	规格书
131页	9265K
描述
DDR2 SDRAM

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数据手册

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MT47H128M8 数据手册

1Gb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H256M4 – 32 Meg x 4 x 8 banks

MT47H128M8 – 16 Meg x 8 x 8 banks

MT47H64M16 – 8 Meg x 16 x 8 banks

Options¹

Marking

Features

Configuration

•

V_DD= +1.8V ±0.1V, V_DDQ= +1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

•

256 Meg x 4 (32 Meg x 4 x 8 banks)

128 Meg x 8 (16 Meg x 8 x 8 banks)

64 Meg x 16 (8 Meg x 16 x 8 banks)

256M4

128M8

64M16

–

FBGA package (Pb-free) – x16

•

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

FBGA package (Pb-free) – x4, x8

–

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

60-ball FBGA (8mm x 11.5mm)

Rev. G

–

Posted CAS additive latency (AL)

FBGA package (Pb-free) – x4, x8

•

WRITE latency = READ latency - 1 ^tCK

Selectable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

60-ball FBGA (8mm x 10mm) Rev. H

FBGA package (lead solder) – x16

–

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

–

FBGA package (lead solder) – x4, x8

•

On-die termination (ODT)

60-ball FBGA (8mm x 11.5mm)

Rev. G

–

Industrial temperature (IT) option

RoHS-compliant

FBGA package (lead solder) – x4, x8

•

60-ball FBGA (8mm x 10mm) Rev. H

–

Supports JEDEC clock jitter specification

Timing – cycle time

1.875ns @ CL = 7 (DDR2-1066)

2.5ns @ CL = 5 (DDR2-800)

2.5ns @ CL = 6 (DDR2-800)

3.0ns @ CL = 4 (DDR2-667)

3.0ns @ CL = 5 (DDR2-667)

3.75ns @ CL = 4 (DDR2-533)

-187E

-25E

-25

-3E

-3

–

-37E

Self refresh

•

Standard

Low-power

Operating temperature

– Commercial (0°C ≤ T_C≤ 85°C)

– Industrial (–40°C ≤ T_C≤ 95°C;

–40°C ≤ T_A≤ 85°C)

None

–

None

:G/:H

– Automotive (–40°C ≤ T_C, T_A≤ 105ºC)

Revision

•

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on www.micron.com for

product offerings and availability.

Note:

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

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