是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 包装说明: | 33 X 33 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1023 |
Reach Compliance Code: | not_compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.67 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 133 MHz |
外部数据总线宽度: | 32 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B1023 |
JESD-609代码: | e2 | 长度: | 33 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 1023 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, HEAT SINK/SLUG | 峰值回流温度(摄氏度): | 245 |
座面最大高度: | 3.38 mm | 速度: | 1500 MHz |
最大供电电压: | 1.155 V | 最小供电电压: | 1.045 V |
标称供电电压: | 1.1 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver (Sn/Ag) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 33 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MPC8572E_11 | FREESCALE | MPC8572E PowerQUICC III Integrated Processor Hardware Specifications |
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MPC8572ECLPXARLD | FREESCALE | MPC8572E PowerQUICC III Integrated Processor Hardware Specifications |
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MPC8572ECLPXARLE | NXP | PowerQUICC 32-Bit Power Arch SoC, 2 X 1.067GHz, DDR2/3, PCIe, GbE, SRIO, SEC, -40 to 105C, |
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|
MPC8572ECLPXATLD | NXP | IC,MICROPROCESSOR,32-BIT,BGA,1023PIN,PLASTIC |
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|
MPC8572ECLPXATLD | FREESCALE | MPC8572E PowerQUICC III Integrated Processor Hardware Specifications |
获取价格 |
|
MPC8572ECLPXATLE | NXP | PowerQUICC 32-Bit Power Arch SoC, 2 X 1.2GHz, DDR2/3, PCIe, GbE, SRIO, SEC, -40 to 105C, R |
获取价格 |