是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | QFN |
包装说明: | 4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, QFN-20 | 针数: | 20 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.64 |
Samacsys Confidence: | Samacsys Status: | Released | |
Schematic Symbol: | https://componentsearchengine.com/symbol.php?partID=599351 | PCB Footprint: | https://componentsearchengine.com/footprint.php?partID=599351 |
Samacsys PartID: | 599351 | Samacsys Image: | https://componentsearchengine.com/Images/9/73S8009R-IMR/F.jpg |
Samacsys Thumbnail Image: | https://componentsearchengine.com/Thumbnails/1/73S8009R-IMR/F.jpg | Samacsys Pin Count: | 21 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Other |
Samacsys Footprint Name: | QFN50P400X400X90-21N | Samacsys Released Date: | 2017-01-11 21:24:41 |
Is Samacsys: | N | 其他特性: | ALSO OPERATES WITH 5 VOLT SUPPLY |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-XQCC-N20 |
长度: | 4 mm | 功能数量: | 1 |
端子数量: | 20 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.7 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 4 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
73S8009R-ILR | TERIDIAN | Analog Circuit, 1 Func, PDSO28, SOP-28 |
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73S8009R-ILR/F | TERIDIAN | Low Cost Versatile Smart Card Interface |
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73S8009R-IM | TERIDIAN | Analog Circuit, 1 Func, 4 X 4 MM, 0.80 MM HEIGHT, QFN-20 |
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73S8009R-IM/F | TERIDIAN | Low Cost Versatile Smart Card Interface |
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73S8009R-IMR/F | TERIDIAN | Low Cost Versatile Smart Card Interface |
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73S8010C | TERIDIAN | Smart Card Interface |
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