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1N5408 PDF预览

1N5408

更新时间: 2024-02-14 05:50:05
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管
页数 文件大小 规格书
3页 139K
描述
1N5408-DO27-【ASEMI】DATASHEET

1N5408 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:not_compliant
HTS代码:8541.10.00.80风险等级:5.09
应用:GENERAL PURPOSE外壳连接:ISOLATED
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJEDEC-95代码:DO-201AD
JESD-30 代码:O-PALF-W2JESD-609代码:e0
最大非重复峰值正向电流:200 A元件数量:1
相数:1端子数量:2
最大输出电流:3 A封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:LONG FORM
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大重复峰值反向电压:1000 V表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:WIRE
端子位置:AXIAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

1N5408 数据手册

 浏览型号1N5408的Datasheet PDF文件第2页浏览型号1N5408的Datasheet PDF文件第3页 
SMBG5913 thru SMBG5956B, e3  
SMBJ5913 thru SMBJ5956B, e3  
SILICON 2.0 Watt ZENER DIODES  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 2.0  
watt Zeners provides voltage regulation in a selection from 3.3 to 200  
volts with different tolerances as identified by suffix letter on the part  
number. This series is equivalent to the JEDEC registered 1N5913 thru  
1N5956B with identical electrical characteristics except it is rated at 2.0 W  
instead of 1.5 W with the lower thermal resistance features of the surface  
mount packaging. It is available in J-bend design (SMBJ) with the DO-  
214AA package for greater PC board mounting density or in Gull-wing  
design (SMBG) in the DO-215AA for visible solder connections. It is also  
available as RoHS Compliant with an e3 suffix. Microsemi also offers  
numerous other Zener products to meet higher and lower power  
NOTE: All SMB series are  
equivalent to prior SMS package  
identifications.  
applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount equivalent to 1N5913 to 1N5956B  
Ideal for high-density and low-profile mounting  
Zener voltage available 3.3V to 200V  
Regulates voltage over a broad operating  
current and temperature range  
Wide selection from 3.3 to 200 V  
Popular DO-214AA or DO-215AA packages  
and footprints for either high density J-bend or  
Gull-wing designs for visible solder joints  
Standard voltage tolerances are plus/minus 5% with  
B suffix and 10 % with A suffix identification  
Tight tolerances available in plus or minus 2% or 1%  
Nonsensitive to ESD per MIL-STD-750 Method  
1020  
with C or D suffix respectively  
Options for screening in accordance with MIL-PRF-19500  
for JAN, JANTX, JANTXV, and JANS are available by  
adding MQ, MX, MV, or MSP prefixes respectively to part  
numbers.  
Withstands high surge stresses (see Figure 2)  
Moisture classification: Level 1 per IPC/JEDEC  
J-STD-020B with no dry pack required  
RoHS Compliant devices available by adding an “e3” suffix  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Power dissipation at 25ºC: 2.0 watts (also see  
derating in Figure 1).  
CASE: Void-free transfer molded  
thermosetting epoxy body meeting UL94V-0  
Operating and Storage temperature: -65ºC to  
TERMINALS: Gull-wing or C-bend (modified  
J-bend) tin-lead or RoHS compliant annealed  
matte-Tin plating solderable per MIL-STD-750,  
method 2026  
+150ºC  
Thermal Resistance: 35 ºC/W junction to lead, or  
100ºC/W junction to ambient when mounted on FR4  
PC board (1oz Cu) with recommended footprint (see  
last page)  
POLARITY: Cathode indicated by band.  
Diode to be operated with banded end positive  
with respect to opposite end for Zener  
regulation  
Steady-State Power: 2 watts at TL < 80oC, or 1.25  
watts at TA = 25ºC when mounted on FR4 PC board  
with recommended footprint (also see Figure 1)  
MARKING: Includes part number without  
prefix (e.g. 5913B, 5913Be3, 5948C, 5956D,  
etc.)  
Forward voltage @200 mA: 1.2 volts (maximum)  
Solder Temperatures: 260 ºC for 10 s (maximum)  
TAPE & REEL option: Standard per EIA-481-1-  
A with 12 mm tape, 750 per 7 inch reel or 2500  
per 13 inch reel (add “TR” suffix to part number)  
WEIGHT: 0.1 grams  
See package dimensions on last page  
Copyright © 2006  
1-31--2006 REV G  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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